背面研磨膠帶介紹

Backside Grinding Tape is used to protect the wafer surface during wafer back grinding after the device is formed on the wafer and the wafer passes tests.

背面研磨膠帶用于在晶圓上形成器件且晶圓通過測(cè)試后，在晶圓背面研磨期間保護(hù)晶圓表面。

Back grinding occur only on the back side of the wafer, during this process chemically contaminated parts of the wafer removed and thickness of the chip reduced. 

The thickness of the wafer defines the size of the finial package, which in turn, is useful to reduce resistance of the chip and power consumption.

背面研磨僅發(fā)生在晶圓的背面，在此過程中，晶圓的化學(xué)污染部分被去除，芯片的厚度減小。晶圓的厚度決定了最終封裝的尺寸，這反過來又有助于降低芯片的電阻和功耗。

Back grinding tapes, attached on the circuit surface, wafer front side. It prevents damages to the circuit and pollutions to the wafer surface and improves the grinding accuracy of the wafer. 

Especially,it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties。

On the other hand, thin wafers can be easily band or get broken, which makes their handling very difficult。

背面研磨膠帶，貼在電路表面，晶圓正面。防止電路損壞和晶片表面污染，提高晶片的研磨精度。尤其是其優(yōu)異的物理化學(xué)性能，可以在制造過程中完美保護(hù)晶圓圖案表面和芯片。另一方面，薄晶圓很容易彎曲或斷裂，這使得它們的處理非常困難。

Back grinding process

背面研磨過程

It is typically divided in 3 steps, taping, grinding and tape removing.

1)Tape mounting to the front side of the wafer. During this step it is necessary that there is no bubbles or air traps.

2)Back grinding process. Can be performed in 3 steps, coarse, fine grinding, and Chemical Mechanical Planarization (CMP) or supper fine grinding.

3)The last process is the tape peeling, wherein BG tape is removed from the wafer front side.

Typically, UV and non-UV tape removing. After peeing of the tape there should be no residue left on the wafer.

它通常分為3個(gè)步驟，膠帶、研磨和膠帶去除。

Tape structure

膠帶結(jié)構(gòu)

Tape is usually 3 layers, but some tapes have more layers depending on surface construction of wafer/substrate and process requirements.

所需功能

Tape types

膠帶類型

There is major two classification of Back Grinding Tapes, UV Type, Non-UV Type.
To Non-UV belongs wafer that can be directly peeled off, or adhesive strength can be reduced at elevated temperatures and then peeled off.
UV tapes adhesive strength is drastically reduced after ultraviolet irradiation, then tape can be easily peeled off. There is no or minimum adhesive residue left on the wafer surface, there is no cleaning step is necessary after application of UV tapes. Higher initial adhesive strength prevents forming of the bubbles, and low adhesive strength after UV irradiation will not induce high stresses on the wafer, this is necessary。